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Mark Stephen Topping

from Lincoln Park, MI
Age ~71
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Also known as:
Mark S Topping
Phone and address:
1399 Detroit Ave, Lincoln Park, MI 48146
(313) 381-5729
Related to:
Cathy E Topping, 71Sean M Topping, 36Ruth E ToppingDavid S Topping, 35John C Topping, 77Debra B Topping, 71Emily E Heyler, 39Jonathan E Heyler, 39Clarence L Topping
Connected to:
Anita K Topping, 62Becky E Topping, 45Connie M Topping, 74Daniel R Topping, 41Erika L Topping, 37Faye E Topping, 55Ian L Topping, 37Leon G Topping, 53Lesley E Topping, 69

Mark Topping Phones & Addresses

  • 1399 Detroit Ave, Lincoln Park, MI 48146 (313) 381-5729
  • Dearborn, MI
  • Walthourville, GA
  • Temecula, CA
  • 1399 Detroit Ave, Lincoln Park, MI 48146 (313) 530-4551

Resumes

Resumes

Mark Topping Photo 1

Sr. Electronics Technician At Hyundai-Kia Hatci

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Position:
Sr. Electronics Technician at Hyundai-Kia HATCI
Location:
Greater Detroit Area
Industry:
Electrical/Electronic Manufacturing
Work:
Hyundai-Kia HATCI since Oct 2010
Sr. Electronics Technician
Visteon Jul 2000 - Nov 2007
Application Engineer
Ford Motor Company Jan 1976 - Jan 2000
Engineering Technologist, Applications Engineer
Eaton (Research and Engineering) Jan 1973 - Jan 1976
Electronic Co-Op and Technologist
Education:
Western Michigan University 1972 - 1973
Edsel Ford High School
Henry Ford Community College
Associates Degree, Electronics; Electrical Engineering
Mark Topping Photo 2

Chief Electronics Technician

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Location:
Detroit, MI
Industry:
Automotive
Work:
Hyundai Kia America Technical Center, Inc. (Hatci)
Chief Electronics Technician
Visteon Corporation 2000 - 2007
Applications Engineer
Ford Motor Company Jan 1976 - Jan 2000
Engineering Technologist, Applications Engineer
Eaton Jan 1973 - Jan 1976
Electronic Co-Op and Technologist
Education:
Western Michigan University 1972 - 1973
Edsel Ford High School
Henry Ford College
Associates, Associate of Arts, Electrical Engineering, Electronics
Skills:
Electronics
Automotive
Testing
Automotive Electronics
Fmea
Vehicles
Manufacturing
Calibration
Troubleshooting
Dfmea
Analog
Hev
Manufacturing Engineering
Soldering
Product Engineering
Components
Engineering Management
Root Cause Analysis
Failure Mode and Effects Analysis
Navigation
Telematics
Program Management
Analog Circuit Design
Mark Topping Photo 3

Pool And General Maintenance

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Work:
Sun Vista R V Resort
Pool and General Maintenance
Mark Topping Photo 4

Mark Topping

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Mark Topping Photo 5

Mark Topping

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Mark A Topping
ALL Officers
MARK TOPPING INVESTMENTS, INC

Publications

Us Patents

Method For Ultrasonic Bonding Flexible Circuits

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US Patent:
60192712, Feb 1, 2000
Filed:
Jul 11, 1997
Appl. No.:
8/893714
Inventors:
Brian John Hayden - Royal Oak MI
Cuong Van Pham - Northville MI
Rosa Lynda Nuno - Canton MI
Mark Stephen Topping - Lincoln Park MI
Assignee:
Ford Motor Company - Dearborn MI
International Classification:
B23K 106
B23K 3102
B32B 3116
H05K 116
US Classification:
2281101
Abstract:
A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor. The members are then held together until each joint solidifies, and then the horn and/or anvil are retracted.

Magnetic Energy Monitor For An Ultrasonic Wirebonder

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US Patent:
57328730, Mar 31, 1998
Filed:
Jun 13, 1996
Appl. No.:
8/663574
Inventors:
Mark S. Topping - Lincoln Park MI
Cuong V. Pham - Northville MI
Brian J. Hayden - Royal Oak MI
Assignee:
Ford Motor Company - Dearborn MI
International Classification:
B23K 2010
US Classification:
228 11
Abstract:
An ultrasonic wirebonder has a horn and a transducer for vibrating the horn at a predetermined frequency. A magnet affixed to the horn generates a magnetic field. A coil coupled to the magnet has an output signal induced from the magnetic field moving relative to said coil. A filtering means filters the output signal from the coil to determine the reliably of the ultrasonic bond. An output device is used to monitor the output signal and determine whether the bond is reliable.

Integrated Lighting Assembly

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US Patent:
60769505, Jun 20, 2000
Filed:
Oct 5, 1998
Appl. No.:
9/166247
Inventors:
Mark Stephen Topping - Lincoln Park MI
Michael G. Todd - South Lyon MI
Mark Miller - Monroe MI
Assignee:
Ford Global Technologies, Inc. - Dearborn MI
International Classification:
B60Q 100
US Classification:
362545
Abstract:
An integrated lighting assembly (10) includes an injection molded housing that has a base (12) with first fastening elements (22) molded thereon, a cover (18) with second fastening elements (24) molded thereon, and a substrate (16) intermediate the base and cover. An electrical circuit (30) is formed on the substrate and a lighting element (32) is attached to the electrical circuit. A reflective cone (34, 36) surrounds the lighting element to intensify its light and direct light through a diffuser lens (28) formed on the base. A reflective wall (26) on the base reflects light emanating from the diffuser lens in a predetermined pattern. Metal for the reflective surface and electrical circuit is deposited in a single operation. The base and cover are connected to the substrate by living hinges. When the cover is folded onto the base, the first and second fastening elements snap together to form a three dimensional lighting assembly.

Method Of Soldering Materials Supported On Low-Melting Substrates

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US Patent:
59214600, Jul 13, 1999
Filed:
Jun 5, 1997
Appl. No.:
8/870049
Inventors:
Mark Stephen Topping - Lincoln Park MI
Cuong Van Pham - Northville MI
Brian John Hayden - Royal Oak MI
Assignee:
Ford Motor Company - Dearborn MI
International Classification:
H05K 334
H01L 21607
US Classification:
2281115
Abstract:
A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate. The method facilitates making electrical connections for completing an electronic circuit unit that is supported on a low temperature melting substrate and comprises (a) positioning together first and second conductive terminals for said circuit with a solder deposit therebetween to form an assembly, at least one of the terminals of such assembly being supported directly on such low temperature melting substrate; (b) gripping the assembly between an ultrasonic motion generating horn and an anvil, while exciting the horn to apply ultrasonic vibration to the first terminal to provide sufficient shearing energy that frictionally rubs at least one surface of the solder deposit in a rubbing direction generally parallel to said one surface to rapidly heat and melt the solder deposit; and (c) essentially immediately upon the completion melting of the solder deposit, ceasing the application of ultrasonic shearing energy to allow the solder to solidify and form a soldered diffusion joint between the terminals.
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Mark Stephen Topping from Lincoln Park, MI, age ~71 Get Report