Jeffrey Curtis Thompson

7430731, Sep 30, 2008

Jan 3, 2005

11/028943

Adam L. Cohen - Los Angeles CA, US
Jeffrey A. Thompson - Los Angeles CA, US

University of Southern California - Los Angeles CA

G06F 17/50
G06F 19/00
G03F 1/00
G21K 5/00
H01L 21/44
H01L 21/31

716 21, 700 98, 700119, 700121, 430 5, 378 35, 438607, 438669, 438761

Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

7623935, Nov 24, 2009

Jan 3, 2005

11/029173

Adam L. Cohen - Los Angeles CA, US
Jeffrey A. Thompson - Los Angeles CA, US

University of Southern California - Los Angeles CA

G06F 17/50
G06F 19/00

700 95, 700119, 700121, 430 5, 378 35, 438607, 438669, 438761

Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

20050067292, Mar 31, 2005

May 7, 2004

10/841006

Jeffrey Thompson - Los Angeles CA, US
Adam Cohen - Los Angeles CA, US
Michael Lockard - Lake Elizabeth CA, US
Dennis Smalley - Newhall CA, US

C25D005/02

205118000, 205170000

Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

20050205430, Sep 22, 2005

Nov 24, 2004

10/997709

Jeffrey Thompson - Los Angeles CA, US

C25D005/10

205170000

Embodiments include treatment of substrates, formation of structures, and formation of multilayer structures using contact masks where a controlled mating of the contact masks and substrates is used. Some embodiments involve controlled mating at speeds equal to or less than 10 microns/second, more preferably equal to or less than 5 microns/second, and even more preferably equal to or less than 1 micron/second. Some embodiments involve controlled mating that uses a higher speed of approach when further away followed by a slower speed of approach to cause mating. Some embodiments involve controlled mating that uses a higher speed of approach when making preliminary contact, then backing away a desired distance, and then making a mating approach that causes mating while using a slower mating speed.

20090038948, Feb 12, 2009

Aug 13, 2008

12/191258

Jeffrey A. Thompson - Los Angeles CA, US
Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Dennis R. Smalley - Newhall CA, US

C25D 5/02

205118

Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

20090145767, Jun 11, 2009

Sep 30, 2008

12/242713

Adam L. Cohen - Los Angeles CA, US
Jeffrey A. Thompson - Los Angeles CA, US

C25D 5/02

205135, 205118

Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

20110180410, Jul 28, 2011

Jan 20, 2011

13/010324

Jeffrey A. Thompson - Los Angeles CA, US
Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Dennis R. Smalley - Newhall CA, US

C25D 1/00

205 70, 205 67

Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

20220212899, Jul 7, 2022

Mar 22, 2022

17/700949

Jeffrey D. Thompson - Irvine CA, US

B66C 5/02
B66C 7/02
B66C 11/16
B66C 11/04

There is provided a method of installing spiral hangers about a messenger line installed between first and second utility poles with a cable being lashed to the messenger line with a lashing wire. The method includes attaching a first and second spiral hangers to the messenger line between first and second utility poles with the first spiral hanger disposed about the messenger line and the cable. The method includes removing the lashing wire from being around the messenger line and the cable adjacent the second spiral hanger. The method includes moving the second spiral hanger towards the second utility pole. The method includes attaching a successive spiral hanger to the messenger line between the spiral hangers and repeating the moving of the second spiral hanger and attaching another successive spiral hanger.