Eric Chang

7277346, Oct 2, 2007

Dec 14, 2004

11/012877

Irfan Rahim - San Jose CA, US
Peter J. McElheny - Morgan Hill CA, US
Eric Choong-Yin Chang - Cupertino CA, US

Altera Corporation - San Jose CA

G11C 17/18

3652257, 326 39, 326 10, 326 12, 326 13, 365200, 365201, 36518509

A semiconductor system and method for repairing failures of a packaged integrated circuit system are provided. The method includes detecting a failure associated with a packaged integrated circuit system after the packaged integrated circuit system is packaged, and repairing the failure by activating a redundancy circuit in the packaged integrated circuit system and deactivating a defective circuit associated with the failure. The process for repairing the failure includes applying a repair voltage to a polysilicon fuse to change a conductivity state of the polysilicon fuse from a first state to a second state. In another embodiment, the polysilicon fuse is replaced by a metal fuse, an anti-fuse, or a non-volatile random access memory.

7319341, Jan 15, 2008

Aug 28, 2003

10/653045

Michael Harms - Pleasanton CA, US
Eric C. Chang - Cupertino CA, US
Paul Tracy - Sunnyvale CA, US
John DiCosola - Pleasanton CA, US
Mandrita Brahmachari - Milpitas CA, US

Altera Corporation - San Jose CA

G01R 31/26

324765

The present invention is a novel method and computer program product which utilizes an interface capacitor formed by the metal of the probe tip, a dielectric layer, such as an oxide, formed by a contaminant on a solder bump and the metal of the solder bump. The interface capacitor forms a capacitive divider with the inherent capacitances of the automatic test equipment and the device under test (DUT). The voltage characteristics of the capacitive divider are used to drive voltage signals across the interface capacitor to test the DUT. In either direction (i. e. from the automatic test equipment to the DUT or vice versa), by altering the voltage output high amplitude of the driver and/or the voltage input high amplitude of the load, the DUT is validly tested through the interface capacitor. Thus, even if all I/O bumps have an oxide layer, the device may still be validly tested.

7671579, Mar 2, 2010

Sep 7, 2006

11/470898

Yan Chong - San Jose CA, US
Joseph Huang - Morgan Hill CA, US
Chiakang Sung - Milpitas CA, US
Eric Choong-Yin Chang - Cupertino CA, US
Peter Boyle - Mountain View CA, US
Adam J. Wright - Saratoga CA, US

Altera Corporation - San Jose CA

G01R 23/175
G08B 23/00

324 7654, 324 7635, 340527

Delay associated with each of two signals along respective transmission paths is accurately measured using a delay measurement circuit that is fabricated in situ on the actual device where the circuitry for propagating the two signals is fabricated. Thus, the measured delay associated with each of the two signals is subject to the same fabrication-dependent attributes that affect the actual circuitry through which the two signals will be propagated during operation of the device. The skew between the two signals is quantified as the difference in the measured delays. Coarse and fine delay modules are defined within the transmission path of each of the two signals. Based on the measured skew between the two signals, the coarse and fine delay modules are appropriately set to compensate for the skew. The appropriately settings for the coarse and fine delay modules can be stored in non-volatile memory elements.

7884619, Feb 8, 2011

Sep 24, 2009

12/566157

Yan Chong - San Jose CA, US
Joseph Huang - Morgan Hill CA, US
Chiakang Sung - Milpitas CA, US
Eric Choong-Yin Chang - Cupertino CA, US
Peter Boyle - Mountain View CA, US
Adam J. Wright - Saratoga CA, US

Altera Corporation - San Jose CA

G01R 35/00
G01R 23/175
G08B 23/00
H03L 7/00

324601, 324 7654, 340527, 327153

Delay associated with each of two signals along respective transmission paths is accurately measured using a delay measurement circuit that is fabricated in situ on the actual device where the circuitry for propagating the two signals is fabricated. Thus, the measured delay associated with each of the two signals is subject to the same fabrication-dependent attributes that affect the actual circuitry through which the two signals will be propagated during operation of the device. The skew between the two signals is quantified as the difference in the measured delays. Coarse and fine delay modules are defined within the transmission path of each of the two signals. Based on the measured skew between the two signals, the coarse and fine delay modules are appropriately set to compensate for the skew. The appropriately settings for the coarse and fine delay modules can be stored in non-volatile memory elements.

20110221497, Sep 15, 2011

Feb 1, 2011

13/019277

Yan Chong - San Jose CA, US
Joseph Huang - Morgan Hill CA, US
Chiakang Sung - Milpitas CA, US
Eric Choong-Yin Chang - Cupertino CA, US
Peter Boyle - Mountain View CA, US
Adam J. Wright - Saratoga CA, US

H03L 7/00
H03H 11/26

327161, 327284

Delay associated with each of two signals along respective transmission paths is accurately measured using a delay measurement circuit that is fabricated in situ on the actual device where the circuitry for propagating the two signals is fabricated. Thus, the measured delay associated with each of the two signals is subject to the same fabrication-dependent attributes that affect the actual circuitry through which the two signals will be propagated during operation of the device. The skew between the two signals is quantified as the difference in the measured delays. Coarse and fine delay modules are defined within the transmission path of each of the two signals. Based on the measured skew between the two signals, the coarse and fine delay modules are appropriately set to compensate for the skew. The appropriately settings for the coarse and fine delay modules can be stored in non-volatile memory elements.

20140006314, Jan 2, 2014

Feb 12, 2013

13/765045

Tom Mercer - San Francisco CA, US
Eric Chang - Menlo Park CA, US
Richard Tyler Curtis - Washington DC, US
Daniel J. Yates - Washington DC, US

Opower, Inc. - Arlington VA

G06Q 30/02

705412

Illustrative embodiments of the present invention are directed to methods and computer systems for reporting unusual or anomalous usage or spending of a commodity by consumers. A computer system retrieves a set of usage-information datasets corresponding to a set of consumers, each dataset including past usage of the commodity during at least one of a completed billing period and a current usage of the commodity during the current billing period. The computer system establishes a set of report-trigger conditions for the current billing period, each of the report-trigger conditions corresponding to a consumer. The computer system monitor usage or spending of the set of consumers to determine, for each consumer, whether an estimated usage established for each consumer fulfills the consumer's report-trigger condition. Once the report-trigger condition is fulfilled, the computer system outputs a report to the consumer.

61343242, Oct 17, 2000

May 29, 1997

8/865307

James Bohannon - San Jose CA
Eric Chang - San Jose CA

LSI Logic Corporation - Milpitas CA

H04L 900

380 4

A technique for mass distributing software products, especially integrated circuit design tools and design libraries, while allowing only a selected portion of the products to be loaded onto and used on a computer. One or more volumes of CD-ROM contains one or more software products, each of which are encrypted with a key code. The CD-ROMs are mass distributed to customers. A separate configuration file, uniquely configured for each customer, contains a list of only the selected portion of software products, and contains the key codes for decrypting only those products. A loader module is provided for controlling the decryption and loading of only the selected portion of products, based on information in the configuration file. Each software product is hierarchically arranged by class, file set and file, and files may be shared between products.

20220245100, Aug 4, 2022

Jan 29, 2021

17/162474

- Palo Alto CA, US
Eric Ray Chang - San Francisco CA, US
William Edward Gurling - Madison NC, US

G06F 16/21
G06F 16/25
G06F 16/182
G06F 11/14
G06F 3/0482

A cross-platform data migration method and a cross-platform data migration system include determining that a first database is compatible with a second database, receiving a user request associated with an instruction to migrate data from the first database to the second database, determining that backup data corresponding to a current state of the first database is available, mounting the backup data onto the second platform via a distributed file system protocol, converting the backup data from the source endian format to a target endian format, and restoring the backup data in the target endian format to the second platform.